Modelling of heat transfer in waterjet guided laser drilling of silicon
نویسندگان
چکیده
Waterjet guided laser processing is an internationally patented technique based on guiding a laser beam inside a thin, high-speed waterjet. The process combines the advantages of laser processing with those of waterjet cutting. It is very suitable in processing thin and heat-sensitive materials with a high degree of precision required. A model and simulation method for waterjet guided laser drilling on a silicon substrate are presented in this study. A ®nite di erence method has been developed to simulate the thermal ®eld and phase changes involved. The model represents the thermal process in detail. The simulation results predict the main characteristics of waterjet guided laser drilling. The study gives insight into the interactions between the laser beam, waterjet and workpiece material during drilling of a silicon substrate.
منابع مشابه
Modeling of waterjet guided laser grooving of silicon
Waterjet guided laser processing is an internationally patented technique based on guiding a laser inside a thin, high-speed waterjet. The process combines the advantages of laser processing with those of waterjet cutting and offers promise as a method for processing thin and heat sensitive materials with a high degree of precision. An improved understanding of the complex interaction between l...
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